Scholarship
Economic Development Board Industrial Postgraduate Programme (EDB-IPP)

An initiative to build a pool of postgraduate manpower in Singapore with critical R&D skillsets for roles in the industry. It facilitates collaboration between universities and industry partners.
About this scholarship
Economic Development Board Industrial Postgraduate Programme (EDB-IPP) is offered by Singapore Economic Development Board for study in Singapore at master and phd level. The award is valued at Varies by project, provided as tuition and living support. Funding is awarded for a single cycle and is not listed as renewable.
What the funding covers
This scholarship is classified as tuition and living funding. Applicants selected receive Varies by project. Selection is merit-based, so academic and personal achievement carry the most weight.
Who can apply
The award is open to candidates applying at master and phd level. Eligible study areas include Science, Engineering and Technology. No nationality restriction is recorded for this award.
Eligibility
Postgraduate students pursuing research-based degrees in Singapore with a focus on industry-relevant R&D.
How to apply
No fixed closing date is published, so check the provider for the current cycle. Requirements are set by the provider and can change between intakes, so verify each item on the official page before submitting.
Eligible study levels
master and phd
Fields of study
Science, Engineering and Technology
Funding basis
Merit-based
Key details
- Provider
- Singapore Economic Development Board
- Country
- Singapore
- Award
- Varies by project
- Funding type
- tuition and living
- Selection basis
- Merit-based
- Study levels
- master and phd
- Fields of study
- Science, Engineering and Technology
- Nationality
- No restriction recorded
- Deadline
- Rolling
- Renewable
- No
- Verified by Eternity
- Not yet verified
- Last verified
- 2026-08-31
Confirm current eligibility, deadlines, and application instructions with the provider before applying.
View official scholarship sourceLast verified 2026-08-31


